SYNTHESIS OF COPPER NANOPARTICLES WITH VARIOUS SIZES TOWARDS IMPROVING THE ELECTRICAL CONDUCTIVITY OF COPPER FILMS AT LOW SINTERING TEMPERATURE

Anh Tuan Luu, Dat Vinh Vuong, Anh Phan Nhat Nguyen

Abstract


The use of copper nanoparticles (CuNPs) in conductive inks has attracted much attention to printed circuit board manufacturers due to its high electrical conductivity and low cost. The synthesis of CuNPs by surfactant-assisted chemical reduction method was studied aiming to identify the content of PVP-surfactant corresponding to the size of copper particles. The crystallite size and phase of CuNPs were determined by X-ray diffraction (XRD) analysis while transmission and scanning electron microscopy (TEM and SEM) were used to characterize the size of copper particles. The results showed that the crystallite and particle size of CuNPs decrease with increasing the PVP-surfactant concentration. The crystallite size values measured by TEM and XRD methods have a slight variation. The copper films were fabricated by the doctor-blade technique on PI and Al2O3 substrates. The effect of sintering temperature on conductive properties of the copper film after sintering was investigated. The copper film was sintered at low temperatures below 300oC. The electrical conductivity of copper films was measured by using the four-point probe method. The electrical resistivity of copper films archives stable at the low sintering temperature above 200°C about 0.22 mΩ.cm and 0.63 mΩ.cm for that of Al2O3 and PI substrates respectively.


Full Text:

PDF


DOI: https://doi.org/10.15625/2525-2518/57/3A/14073 Display counter: Abstract : 134 views. PDF : 74 views.

Refbacks

  • There are currently no refbacks.


budidaya tani

Index: Google Scholar; Crossref; VCGate; Asean Citation Index

Published by Vietnam Academy of Science and Technology